PCB Manufacturing Capabilities For 1-40 Layers, High-Precision, Special Process

Adopt advanced production equipment to achieve high quality production process, such as bare copper, immersion gold, immersion silver, HASL LF, OSP, buried hole, impedance control and other special processes we can do.

Project





Multilayer

layer


MAX


protype:40L



MAX


mass:24L






board thickness


MIN


protype:0.2mm





mass:0.4mm








MAX


protype:6.4mm





mass:5.0mm






base copper

inner layer

MIN


protype :0.5 OZ



MAX


mass :6 OZ







outer layer

MIN


protype :1/3 OZ



MAX


mass :6 OZ

hole size


MIN


protype:0.1mm




mass:0.1mm

hole tolerance


MIN


PTH:±0.05mm





NPTH:±0.025mm

electroplating aspect ratio


MAX


protype:22:1





mass:10:1

routing tolerance


MIN


protype:±0.05mm




mass:±0.075mm

Line Width/Spacing

inner layer

MIN


0.05/0.05mm


outer layer

MIN


0.075/0.075mm

Impedance tolerance


MIN


protype:±8%




mass:±8%

shipment size


MIN


protype:880*1200mm



MAX


mass:800*800mm

BGA pad


MIN


0.15mm

BGA spacing


MIN


0.5mm

bow and twist


MIN


0.005

special process

gold finger、depth drill、back drill、cap plating






HDI

layer


MAX


18L

board thickness


MIN


0.3mm

hole size

blind via

MIN


0.05mm

buried via

MIN


0.10mm

via

MIN


0.10mm

hole tolerance


MIN


PTH:±0.05mm




NPTH:±0.025mm

blind via aspect ratio


MAX


≤1:1

routing tolerance


MIN


protype:±0.05mm




mass:±0.075mm

Line Width/Spacing


MIN


0.04/0.04mm

Laser blind via filling depression


MIN


15/10um

Impedance tolerance


MIN


±8%

BGA pad


MIN


0.15mm

BGA spacing


MIN


0.3mm

bow and twist


MIN


0.005