PCB Manufacturing Capabilities For 1-40 Layers, High-Precision, Special Process | |||||
Adopt advanced production equipment to achieve high quality production process, such as bare copper, immersion gold, immersion silver, HASL LF, OSP, buried hole, impedance control and other special processes we can do. | |||||
Project | |||||
Multilayer | layer | MAX | protype:40L | ||
MAX | mass:24L | ||||
board thickness | MIN | protype:0.2mm | |||
mass:0.4mm | |||||
MAX | protype:6.4mm | ||||
mass:5.0mm | |||||
base copper | inner layer | MIN | protype :0.5 OZ | ||
MAX | mass :6 OZ | ||||
outer layer | MIN | protype :1/3 OZ | |||
MAX | mass :6 OZ | ||||
hole size | MIN | protype:0.1mm | |||
mass:0.1mm | |||||
hole tolerance | MIN | PTH:±0.05mm | |||
NPTH:±0.025mm | |||||
electroplating aspect ratio | MAX | protype:22:1 | |||
mass:10:1 | |||||
routing tolerance | MIN | protype:±0.05mm | |||
mass:±0.075mm | |||||
Line Width/Spacing | inner layer | MIN | 0.05/0.05mm | ||
outer layer | MIN | 0.075/0.075mm | |||
Impedance tolerance | MIN | protype:±8% | |||
mass:±8% | |||||
shipment size | MIN | protype:880*1200mm | |||
MAX | mass:800*800mm | ||||
BGA pad | MIN | 0.15mm | |||
BGA spacing | MIN | 0.5mm | |||
bow and twist | MIN | 0.005 | |||
special process | gold finger、depth drill、back drill、cap plating | ||||
HDI | layer | MAX | 18L | ||
board thickness | MIN | 0.3mm | |||
hole size | blind via | MIN | 0.05mm | ||
buried via | MIN | 0.10mm | |||
via | MIN | 0.10mm | |||
hole tolerance | MIN | PTH:±0.05mm | |||
NPTH:±0.025mm | |||||
blind via aspect ratio | MAX | ≤1:1 | |||
routing tolerance | MIN | protype:±0.05mm | |||
mass:±0.075mm | |||||
Line Width/Spacing | MIN | 0.04/0.04mm | |||
Laser blind via filling depression | MIN | 15/10um | |||
Impedance tolerance | MIN | ±8% | |||
BGA pad | MIN | 0.15mm | |||
BGA spacing | MIN | 0.3mm | |||
bow and twist | MIN | 0.005 |